Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12253727 | Electronic device | Chun-Hung Kuo | 2025-03-18 |
| 11937366 | Circuit signal enhancement method of circuit board and structure thereof | Yu-Cheng Lin | 2024-03-19 |
| 11828754 | Modified electrode, manufacturing method thereof and use thereof | Chia-Yu Lin, Shu-Yu Lin, Yi-Hsuan Lai, Shih-Ching Huang, Ting-rong Ko | 2023-11-28 |
| 11508642 | Power module package structure | TZE-YANG YEH, CHING-MING YANG | 2022-11-22 |
| 11430768 | Stacked die chip package structure and method of manufacturing the same | Chen Liu | 2022-08-30 |
| 11302601 | IGBT module with heat dissipation structure and method for manufacturing the same | TZE-YANG YEH, Chih-Hung Shih | 2022-04-12 |
| 11081421 | IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips | TZE-YANG YEH, Chun-Lung Wu | 2021-08-03 |
| 11037857 | IGBT module with heat dissipation structure having copper layers of different thicknesses | TZE-YANG YEH, Chun-Lung Wu | 2021-06-15 |
| 10998258 | Circuit carrier and manufacturing method thereof | — | 2021-05-04 |
| 10964634 | Method of manufacturing circuit carrier with embedded semiconductor substrate | Chien-Chen Lin, Kuan-Wen Fong | 2021-03-30 |
| 10943846 | Chip package structure with heat conductive component and manufacturing thereof | Chien-Chen Lin, Kuan-Wen Fong | 2021-03-09 |
| 10629511 | Heat dissipation substrate, manufacturing method thereof and chip package structure | Chien-Chen Lin | 2020-04-21 |