Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964634 | Method of manufacturing circuit carrier with embedded semiconductor substrate | Chien-Chen Lin, Tzu-Hsuan Wang | 2021-03-30 |
| 10943846 | Chip package structure with heat conductive component and manufacturing thereof | Tzu-Hsuan Wang, Chien-Chen Lin | 2021-03-09 |