Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432883 | Two-phase immersion-type heat dissipation structure having acute-angle notched structures | Chun-Te Wu, CHING-MING YANG, Yu-Wei Chiu | 2025-09-30 |
| 12398963 | Large-size liquid-cooling cooler for electric vehicle | Shih-Ming Chan | 2025-08-26 |
| 12396131 | Two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles | CHING-MING YANG, Chun-Te Wu, Yu-Wei Chiu | 2025-08-19 |
| 12289865 | Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins | Chun-Te Wu, CHING-MING YANG, Yu-Wei Chiu | 2025-04-29 |
| 12274032 | Two-phase immersion-type heat dissipation structure having sheet-like heat dissipation fins | CHING-MING YANG, Chun-Te Wu | 2025-04-08 |
| 12262511 | Two-phase immersion-type heat dissipation device having reinforced fins | Chun-Te Wu, CHING-MING YANG, Yu-Wei Chiu | 2025-03-25 |
| 12207445 | Two-phase immersion-type composite heat dissipation device | Chun-Te Wu, CHING-MING YANG, Yu-Wei Chiu | 2025-01-21 |
| 12156376 | Two-phase immersion-type heat dissipation structure having porous structure | CHING-MING YANG, Chun-Te Wu | 2024-11-26 |
| 12140386 | Heat-dissipating substrate structure | CHING-MING YANG | 2024-11-12 |
| 12120845 | Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same | Yi-Hsin Huang, Chun-Lung Wu, Kuo-Wei Lee | 2024-10-15 |
| 12108574 | Two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation | Chun-Te Wu, CHING-MING YANG, Yu-Wei Chiu | 2024-10-01 |
| 12092406 | Two-phase immersion-type heat dissipation structure having non-vertical fins | CHING-MING YANG, Chun-Te Wu | 2024-09-17 |
| 12048119 | Immersion-type liquid cooling heat dissipation sink | Chi-An Chen | 2024-07-23 |
| 11988467 | Liquid-cooling heat dissipation plate with pin-fins and enclosed liquid cooler having the same | CHING-MING YANG, Chun-Lung Wu | 2024-05-21 |
| 11895778 | Etching method for manufacturing substrate structure having thick electrically conductive layer, and substrate structure having thick electrically conductive layer | SHIH-HSI TAI, Tung-Ho Tao | 2024-02-06 |
| 11761719 | Two-phase immersion-type heat dissipation structure having fins with different thermal conductivities | CHING-MING YANG, Chun-Te Wu | 2023-09-19 |
| 11508642 | Power module package structure | Tzu-Hsuan Wang, CHING-MING YANG | 2022-11-22 |
| 11510342 | Immersion heat dissipation structure | CHING-MING YANG, CHENG-SHU PENG | 2022-11-22 |
| 11506458 | Enclosed heat sink with side wall structure | CHING-MING YANG, REUI-JEN YANG | 2022-11-22 |
| 11469154 | IGBT module with heat dissipation structure having specific layer thickness ratio | SHIH-HSI TAI | 2022-10-11 |
| 11388811 | Heat-dissipating substrate structure with built-in conductive circuits | SHIH-HSI TAI | 2022-07-12 |
| 11302601 | IGBT module with heat dissipation structure and method for manufacturing the same | Tzu-Hsuan Wang, Chih-Hung Shih | 2022-04-12 |
| 11081421 | IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips | Tzu-Hsuan Wang, Chun-Lung Wu | 2021-08-03 |
| 11037857 | IGBT module with heat dissipation structure having copper layers of different thicknesses | Tzu-Hsuan Wang, Chun-Lung Wu | 2021-06-15 |
| 10861768 | IGBT module with improved heat dissipation structure | Chun-Lung Wu | 2020-12-08 |