Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11895778 | Etching method for manufacturing substrate structure having thick electrically conductive layer, and substrate structure having thick electrically conductive layer | Tung-Ho Tao, TZE-YANG YEH | 2024-02-06 |
| 11469154 | IGBT module with heat dissipation structure having specific layer thickness ratio | TZE-YANG YEH | 2022-10-11 |
| 11388811 | Heat-dissipating substrate structure with built-in conductive circuits | TZE-YANG YEH | 2022-07-12 |