Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8849578 | Computational method and apparatus for predicting polypeptide aggregation or solubility | Fabrizio Chiti, Jesus Zurdo | 2014-09-30 |
| 8155888 | Method and apparatus for assessing polypeptide aggregation | Fabrizio Chiti, Jesus Zurdo, Kateri Hayashi DuBay, Michele Vendruscolo | 2012-04-10 |
| 7930157 | Computational method and apparatus for predicting polypeptide aggregation or solubility | Fabrizio Chiti, Jesus Zurdo | 2011-04-19 |
| 7698070 | Method and apparatus for assessing polypeptide aggregation | Fabrizio Chiti, Jesus Zurdo, Kateri Hayashi DuBay, Michele Vendruscolo | 2010-04-13 |
| 7379824 | Computational method and apparatus for predicting polypeptide aggregation or solubility | Fabrizio Chiti, Jesus Zurdo | 2008-05-27 |
| 7309662 | Method and apparatus for forming a film on a substrate | Katherine Giles, Knut Beekmann, John MacNeil, Antony Paul Wilby | 2007-12-18 |
| 6824699 | Method of treating an insulting layer | — | 2004-11-30 |
| 6592770 | Method of treating an isulating layer | — | 2003-07-15 |
| 6423635 | Method of filling a recess | — | 2002-07-23 |
| 6287989 | Method of treating a semiconductor wafer in a chamber using hydrogen peroxide and silicon containing gas or vapor | — | 2001-09-11 |
| 6274245 | Foil for use in filing substrate recesses | Arthur John McGeown | 2001-08-14 |
| 6174823 | Methods of forming a barrier layer | Mark Graeme Martin Harris, Keith Edward Buchanan | 2001-01-16 |
| 6169027 | Method of removing surface oxides found on a titanium oxynitride layer using a nitrogen containing plasma | — | 2001-01-02 |
| 6019847 | Apparatus for applying pressure to a coated surface of a workpiece | — | 2000-02-01 |
| 5932289 | Method for filling substrate recesses using pressure and heat treatment | Arthur John McGeown | 1999-08-03 |
| 5874367 | Method of treating a semi-conductor wafer | — | 1999-02-23 |
| 5858880 | Method of treating a semi-conductor wafer | Adrian Kiermasz | 1999-01-12 |
| 5843535 | forming a layer | — | 1998-12-01 |
| 5527561 | Method for filing substrate recesses using elevated temperature and pressure | — | 1996-06-18 |
| 5492737 | Deposition apparatus and method | Adrian Kiermasz, Knut Beekmann, Christine Shearer, Edmond Ling, Alan Winn +1 more | 1996-02-20 |