Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349615 | SiP system-integration IC chip package and manufacturing method thereof | Xizhou Li, Wei Mu, Yongzhong Wang, Haidong Wei | 2016-05-24 |
| 9210813 | Production method of high-density SIM card package | Xiaowei Guo, Wenhai He, Wei Mu, Xin Chen | 2015-12-08 |