Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349615 | SiP system-integration IC chip package and manufacturing method thereof | Jianyou Xie, Wei Mu, Yongzhong Wang, Haidong Wei | 2016-05-24 |
| 9312242 | Dense-pitch small-pad copper wire bonded double IC chip stack packaging piece and preparation method therefor | Wei Mu, Xiaowei Guo | 2016-04-12 |