Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9210813 | Production method of high-density SIM card package | Jianyou Xie, Xiaowei Guo, Wei Mu, Xin Chen | 2015-12-08 |
| 9136231 | Carrier-free land grid array IC chip package and preparation method thereof | Xiaowei Guo, Wei Mu, Xinjun Wang | 2015-09-15 |