Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12238899 | Thermal management of high heat flux multicomponent assembly | Yuan Zhao | 2025-02-25 |
| 8430264 | Method for packaging thermal interface materials | William E. McIntosh, Jeremy J. Schmitz | 2013-04-30 |
| 8205766 | Method for packaging thermal interface materials | William E. McIntosh | 2012-06-26 |
| 8110919 | Thermal interface with non-tacky surface | Sanjay Misra | 2012-02-07 |
| 8076773 | Thermal interface with non-tacky surface | Sanjay Misra | 2011-12-13 |
| 7760507 | Thermally and electrically conductive interconnect structures | Sanjay Misra | 2010-07-20 |
| 6984685 | Thermal interface pad utilizing low melting metal with retention matrix | Sanjay Misra, G M Fazley Elahee | 2006-01-10 |
| 6657297 | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads | Kasyap Seethamraju, Kevin Hanson | 2003-12-02 |
| 6399209 | Integrated release films for phase-change interfaces | Sanjay Misra, Robert Kranz | 2002-06-04 |