Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693481 | Thermally conductive dielectric interface | John Timmerman, Jeremy L Hammond | 2017-06-27 |
| 8430264 | Method for packaging thermal interface materials | Radesh Jewram, William E. McIntosh | 2013-04-30 |