Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12115287 | Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graft | Allan B. Dietz | 2024-10-15 |
| 11547781 | Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graft | Allan B. Dietz | 2023-01-10 |
| 11447677 | Thermal interface material with mixed aspect ratio particle dispersions | John Timmerman | 2022-09-20 |
| 10722615 | Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graft | Allan B. Dietz | 2020-07-28 |
| 10286116 | Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graft | Allan B. Dietz | 2019-05-14 |
| 10098897 | Methods and materials for reducing development of stenosis of arteriovenous fistulas | Rajiv Kumar | 2018-10-16 |
| 9999158 | Thermally conductive EMI suppression compositions | John Timmerman, Kasyap Seethamraju | 2018-06-12 |
| 9862873 | System for removing organic deposits | Nor Hadhirah Bt Halim, Jamal Mohamad Bin Mohamad Ibrahim, Siti Rohaida Binti Mohd Shafian, Kulwant Singh | 2018-01-09 |
| 9611414 | Thermal interface material with mixed aspect ratio particle dispersions | John Timmerman | 2017-04-04 |
| 9434871 | Method and system for removing organic deposits | Nor Hadhirah Bt Halim, Jamal Mohamad Bin Mohamad Ibrahim, Siti Rohaida Binti Mohd Shafian, Kulwant Singh | 2016-09-06 |
| 8856594 | Method and system for an end-to-end solution in a test automation framework | Pavan Kumar Kurapati, Shaijo Mohan | 2014-10-07 |
| 8110919 | Thermal interface with non-tacky surface | Radesh Jewram | 2012-02-07 |
| 8076773 | Thermal interface with non-tacky surface | Radesh Jewram | 2011-12-13 |
| 7760507 | Thermally and electrically conductive interconnect structures | Radesh Jewram | 2010-07-20 |
| RE39992 | Morphing fillers and thermal interface materials | GM Fazley Elahee | 2008-01-01 |
| 6984685 | Thermal interface pad utilizing low melting metal with retention matrix | Radesh Jewram, G M Fazley Elahee | 2006-01-10 |
| 6898084 | Thermal diffusion apparatus | — | 2005-05-24 |
| 6797758 | Morphing fillers and thermal interface materials | G M Fazley Elahee | 2004-09-28 |
| 6649325 | Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation | Benjamin Gundale | 2003-11-18 |
| 6624224 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters | — | 2003-09-23 |
| 6399209 | Integrated release films for phase-change interfaces | Robert Kranz, Radesh Jewram | 2002-06-04 |
| 6339120 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters | Richard M. Olson | 2002-01-15 |
| 6197859 | Thermally conductive interface pads for electronic devices | Kevin Green | 2001-03-06 |
| 6165612 | Thermally conductive interface layers | — | 2000-12-26 |