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Dual capillary IC wirebonding |
Rex W. Pirkle, David J. Bon |
2012-07-24 |
| 8008183 |
Dual capillary IC wirebonding |
Rex W. Pirkle, David J. Bon |
2011-08-30 |
| 7884449 |
Process for precision placement of integrated circuit overcoat material |
Rex W. Pirkle |
2011-02-08 |
| 7675272 |
Output impedance compensation for linear voltage regulators |
Ronald Andrew Michallick, Rex W. Pirkle |
2010-03-09 |
| 7648857 |
Process for precision placement of integrated circuit overcoat material |
Rex W. Pirkle |
2010-01-19 |
| 7598759 |
Routing engine, method of routing a test probe and testing system employing the same |
Rex W. Pirkle, Michael W. Perry, George Reeves |
2009-10-06 |
| 7241646 |
Semiconductor device having voltage output function trim circuitry and method for same |
Marty Grabham, Ronald Andrew Michallick |
2007-07-10 |
| 7152308 |
Wirebonder to bond an IC chip to a substrate |
Peter J. Sakakinl |
2006-12-26 |
| 6602726 |
Bond surface conditioning system for improved bondability |
Peter Sakakini |
2003-08-05 |