Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10658211 | Data structures for semiconductor die packaging | Joseph Anthony Boduch, Sandia You Ni Chiu, Michael F. Pas | 2020-05-19 | $34,755,000 |
| 10068786 | Data structures for semiconductor die packaging | Joseph Anthony Boduch, Sandia You Ni Chiu, Michael F. Pas | 2018-09-04 | $18,628,000 |