Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7135765 | Semiconductor device package and method of making the same | — | 2006-11-14 |
| 7084011 | Forming a chip package having a no-flow underfill | — | 2006-08-01 |
| 6888255 | Built-up bump pad structure and method for same | Masood Murtuza, Satyendra Singh Chauhan | 2005-05-03 |
| 6849944 | Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad | Masood Murtuza, Satyendra Singh Chauhan | 2005-02-01 |
| 6780673 | Method of forming a semiconductor device package using a plate layer surrounding contact pads | — | 2004-08-24 |