Issued Patents All Time
Showing 101–122 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9300024 | Interface between an integrated circuit and a dielectric waveguide using a dipole antenna, a reflector and a plurality of director elements | Gerd Schuppener, Robert Floyd Payne | 2016-03-29 |
| 9300025 | Interface between an integrated circuit and a dielectric waveguide using a carrier substrate with a dipole antenna and a reflector | Gerd Schuppener, Robert Floyd Payne | 2016-03-29 |
| 9219296 | Coupler to launch electromagnetic signal from microstrip to dielectric waveguide | Robert Floyd Payne, Gerd Schuppener, Baher Haroun | 2015-12-22 |
| 9214415 | Integrating multi-output power converters having vertically stacked semiconductor chips | Marie Denison, Brian Ashley Carpenter, Osvaldo Jorge Lopez, Jonathan Almeria Noquil | 2015-12-15 |
| 9166269 | Retractable dielectric waveguide | Baher Haroun | 2015-10-20 |
| 9165865 | Ultra-thin power transistor and synchronous buck converter having customized footprint | Osvaldo Jorge Lopez, Jonathan Almeria Noquil | 2015-10-20 |
| 9112253 | Dielectric waveguide combined with electrical cable | Robert Floyd Payne, Gerd Schuppener | 2015-08-18 |
| 9076891 | Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer | Osvaldo Jorge Lopez, Jonathan Almeria Noquil | 2015-07-07 |
| 8910369 | Fabricating a power supply converter with load inductor structured as heat sink | Osvaldo Jorge Lopez, Jonathan Almeria Noquil, David Jauregui, Lucian Hriscu | 2014-12-16 |
| 8760872 | DC-DC converter vertically integrated with load inductor structured as heat sink | Osvaldo Jorge Lopez, Jonathan Almeria Noquil, David Jauregui, Lucian Hriscu | 2014-06-24 |
| 8546925 | Synchronous buck converter having coplanar array of contact bumps of equal volume | Osvaldo Jorge Lopez, Jonathan Almeria Noquil, David Jauregui, Mark E. Granahan | 2013-10-01 |
| 8455361 | Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device | Osvaldo Jorge Lopez | 2013-06-04 |
| 8431979 | Power converter having integrated capacitor | Osvaldo Jorge Lopez, Jonathan Almeria Noquil, David Jauregui | 2013-04-30 |
| 8389336 | Semiconductor device package and method of assembly thereof | Jonathan Almeria Noquil, Osvaldo Jorge Lopez | 2013-03-05 |
| 8354303 | Thermally enhanced low parasitic power semiconductor package | Osvaldo Jorge Lopez, Jonathan Almeria Noquil | 2013-01-15 |
| 8304903 | Wirebond-less semiconductor package | George John Przybylek, Osvaldo Jorge Lopez | 2012-11-06 |
| 8049312 | Semiconductor device package and method of assembly thereof | Jonathan Almeria Noquil, Osvaldo Jorge Lopez | 2011-11-01 |
| 7541220 | Integrated circuit device having flexible leadframe | Timothy Brooks Bambridge, Jeffery Gilbert, Jeffrey Klemovage, George Libricz | 2009-06-02 |
| 7433192 | Packaging for electronic modules | Timothy Brooks Bambridge, Osvaldo Jorge Lopez, Joel M. Lott, Hugo Safar, Thomas H. Shilling | 2008-10-07 |
| 7215204 | Intelligent high-power amplifier module | Timothy Brooks Bambridge, Osvaldo Jorge Lopez, Joel M. Lott, Khanh Cong Nguyen | 2007-05-08 |
| 7030472 | Integrated circuit device having flexible leadframe | Timothy Brooks Bambridge, Jeffery Gilbert, Jeffrey Klemovage, George Libricz | 2006-04-18 |
| 6674291 | Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom | Bradley Paul Barber, Peter Ledel Gammel, Hugo Safar, Yiu-Huen Wong | 2004-01-06 |