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Method of forming a semiconductor device |
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Method to reduce frequency distribution of bulk acoustic wave resonators during manufacturing |
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High-temperature isotropic plasma etching process to prevent electrical shorts |
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Piezoeletric wet etch process with reduced resist lifting and controlled undercut |
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High-temperature isotropic plasma etching process to prevent electrical shorts |
Neng Jiang, Thomas Warren Lassiter, Mary Alyssa Drummond Roby, Nayeemuddin Mohammed, YungShan Chang |
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Bond-pad integration scheme for improved moisture barrier and electrical contact |
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