Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8990759 | Contactless technique for evaluating a fabrication of a wafer | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck | 2015-03-24 |
| 8344745 | Test structures for evaluating a fabrication of a die or a wafer | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2013-01-01 |
| 7736916 | System and apparatus for using test structures inside of a chip during the fabrication of the chip | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2010-06-15 |
| 7730434 | Contactless technique for evaluating a fabrication of a wafer | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck | 2010-06-01 |
| 7723724 | System for using test structures to evaluate a fabrication of a wafer | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2010-05-25 |
| 7605597 | Intra-chip power and test signal generation for use with test structures on wafers | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2009-10-20 |
| 7423288 | Technique for evaluating a fabrication of a die and wafer | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2008-09-09 |
| 7339388 | Intra-clip power and test signal generation for use with test structures on wafers | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2008-03-04 |
| 7256055 | System and apparatus for using test structures inside of a chip during the fabrication of the chip | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2007-08-14 |
| 7220990 | Technique for evaluating a fabrication of a die and wafer | Majid Aghababazadeh, Nader Pakdaman, Gary Steinbrueck, James S. Vickers | 2007-05-22 |