Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5538685 | Palladium bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Kensei Murakami | 1996-07-23 |
| 5364706 | Clad bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Kensei Murakami | 1994-11-15 |
| 5298219 | High purity gold bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Kensei Murakami | 1994-03-29 |
| 4938923 | Gold wire for the bonding of a semiconductor device | Koichiro Mukoyama, Hiromi Yamamoto, Kenichi Kurihara | 1990-07-03 |