Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5538685 | Palladium bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Takeshi Kujiraoka | 1996-07-23 |
| 5364706 | Clad bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Takeshi Kujiraoka | 1994-11-15 |
| 5298219 | High purity gold bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Takeshi Kujiraoka | 1994-03-29 |