Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702814 | Gold wire for bonding | Shinichi Hanada | 1997-12-30 |
| 4938923 | Gold wire for the bonding of a semiconductor device | Takeshi Kujiraoka, Hiromi Yamamoto, Kenichi Kurihara | 1990-07-03 |
| 4775512 | Gold line for bonding semiconductor element | Yasuo Fukui, Hiromi Yamamoto | 1988-10-04 |