Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9039052 | Mold structure and bumper | Hideyuki Seto, Shinichi Shimada, Akira Izumi, Sumio Sasaki | 2015-05-26 |
| 5702814 | Gold wire for bonding | Koichiro Mukoyama | 1997-12-30 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9039052 | Mold structure and bumper | Hideyuki Seto, Shinichi Shimada, Akira Izumi, Sumio Sasaki | 2015-05-26 |
| 5702814 | Gold wire for bonding | Koichiro Mukoyama | 1997-12-30 |