Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10272540 | System and method for polishing substrate | Jiun-Yu Lai, Wei-Chen Chang, Yi-Ching Chiou | 2019-04-30 |
| 9669514 | System and method for polishing substrate | Jiun-Yu Lai, Wei-Chen Chang, Yi-Ching Chiou | 2017-06-06 |
| 8021992 | High aspect ratio gap fill application using high density plasma chemical vapor deposition | Joung-Wei Liou, Tsang-Yu Liu, Chien-Feng Lin, Cheng-Liang Chang, Ming-Te Chen +3 more | 2011-09-20 |