JL

Jiun-Yu Lai

AU Asml Us: 2 patents #6 of 55Top 15%
TSMC: 2 patents #6,667 of 12,232Top 55%
MIT: 1 patents #4,386 of 9,367Top 50%
Overall (All Time): #1,177,810 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10272540 System and method for polishing substrate Ying-Hsiu Tsai, Wei-Chen Chang, Yi-Ching Chiou 2019-04-30
9669514 System and method for polishing substrate Ying-Hsiu Tsai, Wei-Chen Chang, Yi-Ching Chiou 2017-06-06
6667239 Chemical mechanical polishing of copper-oxide damascene structures Nanaji Saka, Hilario Oh 2003-12-23
6458013 Method of chemical mechanical polishing Nannaji Saka, Hilario Oh 2002-10-01