Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7133735 | Experiment management system and method thereof in semiconductor manufacturing environment | Chien-Chung Huang, Huei-Wen Yang, Yi-Lin Huang | 2006-11-07 |
| 6712260 | Bump reflow method by inert gas plasma | Chia-Fu Lin, Sheng-Liang Pan, Szu-Yao Wang, Cheng-Yu Chu | 2004-03-30 |
| 6691738 | Filler for airtight container | Szu-Yao Wang, Wen-Hsiang Tseng | 2004-02-17 |
| 6620722 | Bumping process | Szu-Yao Wang | 2003-09-16 |
| 6598314 | Method of drying wafers | Szu-Yao Wang | 2003-07-29 |
| 6330485 | High-speed multi-task system | Wen-Tung Hsu, Kaou-Kuang Wang, Jau-Lan Yeh | 2001-12-11 |