Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6306750 | Bonding pad structure to prevent inter-metal dielectric cracking and to improve bondability | Yung-Sheng Huang, Chiu-Ching Lin, Chun-Hung Lu | 2001-10-23 |
| 6228780 | Non-shrinkable passivation scheme for metal em improvement | So Wein Kuo, Chu-Yun Fu, Syun-Ming Jang | 2001-05-08 |
| 6140603 | Micro-cleavage method for specimen preparation | Yung-Sheng Huang | 2000-10-31 |
| 5933704 | Method to reveal the architecture of multilayer interconnectors in integrated circuits | Yung-Sheng Huang, Chin-Cheng Chiu | 1999-08-03 |