CL

Chiu-Ching Lin

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Tainan, TW: #2,725 of 4,566 inventorsTop 60%
Overall (All Time): #3,597,665 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6306750 Bonding pad structure to prevent inter-metal dielectric cracking and to improve bondability Yung-Sheng Huang, Chun-Hung Lu, Ruey-Lian Hwang 2001-10-23