RT

Roger Tai

TSMC: 8 patents #3,198 of 12,232Top 30%
📍 Tainan, TW: #787 of 4,566 inventorsTop 20%
Overall (All Time): #621,715 of 4,157,543Top 15%
8
Patents All Time

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
11735668 Interfacial layer between fin and source/drain region Chih-Yun Chin, Chii-Horng Li, Chien-Wei Lee, Hsueh-Chang Sung, Heng-Wen Ting +5 more 2023-08-22
11482620 Interfacial layer between Fin and source/drain region Chih-Yun Chin, Chii-Horng Li, Chien-Wei Lee, Hsueh-Chang Sung, Heng-Wen Ting +5 more 2022-10-25
11121255 V-shape recess profile for embedded source/drain epitaxy Chii-Horng Li, Chih-Shan Chen, Yih-Ann Lin, Yen-Ru Lee, Tzu-Ching Lin 2021-09-14
10944005 Interfacial layer between fin and source/drain region Chih-Yun Chin, Chii-Horng Li, Chien-Wei Lee, Hsueh-Chang Sung, Heng-Wen Ting +5 more 2021-03-09
10763366 V-shape recess profile for embedded source/drain epitaxy Chii-Horng Li, Chih-Shan Chen, Yih-Ann Lin, Yen-Ru Lee, Tzu-Ching Lin 2020-09-01
10651309 V-shape recess profile for embedded source/drain epitaxy Chii-Horng Li, Chih-Shan Chen, Yih-Ann Lin, Yen-Ru Lee, Tzu-Ching Lin 2020-05-12
10483396 Interfacial layer between fin and source/drain region Chih-Yun Chin, Chii-Horng Li, Chien-Wei Lee, Hsueh-Chang Sung, Heng-Wen Ting +5 more 2019-11-19
10038095 V-shape recess profile for embedded source/drain epitaxy Chii-Horng Li, Chih-Shan Chen, Yih-Ann Lin, Yen-Ru Lee, Tzu-Ching Lin 2018-07-31