Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9041204 | Bonding pad structure with dense via array | Tsung-Han Tsai, Yueh-Ching Chang, Volume Chien, Huang-Ta Huang, Chi-Cherng Jeng | 2015-05-26 |
| 8951826 | Method for increasing photodiode full well capacity | Chih-Cherng Jeng, Chih-Kang Chao, Ching-Hwanq Su, Yan-Hua Lin, Yu-Shen Shih | 2015-02-10 |