JL

Jun-Yang Lai

TSMC: 3 patents #5,465 of 12,232Top 45%
📍 Guoxing Township, TW: #74 of 230 inventorsTop 35%
Overall (All Time): #1,602,987 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6702900 Wafer chuck for producing an inert gas blanket and method for using Su-Yu Yeh, Huai-Tei Yang, Cheng-Yang Pan 2004-03-09
6479402 Method to improve adhesion of molding compound by providing an oxygen rich film over the top surface of a passivation layer Chie-Ming Yang, Hui-Chi Lin, Jiann-Liang Liou, Cheng-Yeh Shih 2002-11-12
6444541 Method for forming lining oxide in shallow trench isolation incorporating pre-annealing step Jih-Hwa Wang, Chou-Jie Tsai, Chin-Te Huang, Su-Yu Yeh, Meng-Shiun Shieh +2 more 2002-09-03