JW

Jiunn-Wen Weng

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,743,882 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5521121 Oxygen plasma etch process post contact layer etch back Chia-Shiun Tsai, Pin-Nan Tseng 1996-05-28