Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943120 | Method to improve via or contact hole profile using an in-situ polymer deposition and strip procedure | Chuan-Chieh Huang, Chi-Lien Lin | 2005-09-13 |
| 6569777 | Plasma etching method to form dual damascene with improved via profile | Jyh-Shiou Hsu, Pin-Yi Hsin | 2003-05-27 |