Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2023-01-03 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2020-09-22 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2018-10-30 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2016-08-16 |
| 8575725 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-11-05 |
| 8487410 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-07-16 |