Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11343433 | Image processing apparatus having overlapping sub-regions | Sandeep Kumar Goel, Yun-Han Lee | 2022-05-24 |
| 11231767 | Dynamic frequency scaling | Kai-Yuan Ting, Stanley John, Sandeep Kumar Goel | 2022-01-25 |
| 10440281 | Image processing apparatus on integrated circuit and method thereof | Sandeep Kumar Goel, Yun-Han Lee | 2019-10-08 |
| 10061374 | Dynamic frequency scaling | Kai-Yuan Ting, Sandeep Kumar Goel, Stanley John | 2018-08-28 |
| 9646128 | System and method for validating stacked dies by comparing connections | Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh | 2017-05-09 |
| 9625971 | System and method of adaptive voltage frequency scaling | Kai-Yuan Ting, Sandeep Kumar Goel | 2017-04-18 |
| 9612277 | System and method for functional verification of multi-die 3D ICs | Stanley John, Sandeep Kumar Goel, Kai-Yuan Ting | 2017-04-04 |
| 9552448 | Method and apparatus for electronic system model generation | — | 2017-01-24 |
| 9514268 | Interposer defect coverage metric and method to maximize the same | Sandeep Kumar Goel | 2016-12-06 |
| 9404971 | Circuit and method for monolithic stacked integrated circuit testing | Sandeep Kumar Goel | 2016-08-02 |
| 9158881 | Interposer defect coverage metric and method to maximize the same | Sandeep Kumar Goel | 2015-10-13 |
| 9110136 | Circuit and method for monolithic stacked integrated circuit testing | Sandeep Kumar Goel | 2015-08-18 |
| 9047432 | System and method for validating stacked dies by comparing connections | Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh | 2015-06-02 |
| 9015649 | Method and apparatus for electronic system model generation | — | 2015-04-21 |
| 8972918 | System and method for functional verification of multi-die 3D ICs | Stanley John, Sandeep Kumar Goel, Kai-Yuan Ting | 2015-03-03 |
| 8966419 | System and method for testing stacked dies | Sandeep Kumar Goel | 2015-02-24 |
| 8826202 | Reducing design verification time while maximizing system functional coverage | Sandeep Kumar Goel | 2014-09-02 |
| 8578309 | Format conversion from value change dump (VCD) to universal verification methodology (UVM) | Stanley John, Sandeep Kumar Goel, Kai-Yuan Ting | 2013-11-05 |
| 8522177 | Method and apparatus for electronic system function verification at two levels | — | 2013-08-27 |
| 8402404 | Stacked die interconnect validation | Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh | 2013-03-19 |
| 8336009 | Method and apparatus for electronic system function verification at two levels | — | 2012-12-18 |
| 5703881 | Multi-subscriber unit for radio communication system and method | Stanley Kay, Pradeep Kaul, Michael Parr, Graham M. Avis, John Corrigan +1 more | 1997-12-30 |
| 5678180 | Communication system and method providing dispatch and cellular interconnect communications | Lin-Nan Lee, Jim Hobza, Stanley Kay | 1997-10-14 |
| 5633873 | Combined fixed and mobile radio communication system and method | Stanley Kay, Pradeep Kaul, Michael Parr, Graham M. Avis, John Corrigan +1 more | 1997-05-27 |
| 5513183 | Method for exploitation of voice inactivity to increase the capacity of a time division multiple access radio communications system | Stanley Kay, John E. Corrigan III, Daniel Raymond Wendling, Michael Parr | 1996-04-30 |