Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6199273 | Method of forming connector structure for a ball-grid array | Toshihiko Kubo, Takuji Ito, Hiroshi Takamichi | 2001-03-13 |
| 5821455 | Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid | Tetsuya Yamamoto, Hideyuki Yoshino, Roy L. Bell, Rusli Othman | 1998-10-13 |