Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5821455 | Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid | Tetsuya Yamamoto, Hideyuki Yoshino, Akihiro Hidaka, Roy L. Bell | 1998-10-13 |