Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6199273 | Method of forming connector structure for a ball-grid array | Toshihiko Kubo, Takuji Ito, Akihiro Hidaka | 2001-03-13 |
| 6054755 | Semiconductor package with improved moisture vapor relief function and method of fabricating the same | Yoshikazu Nakada | 2000-04-25 |
| 5463248 | Semiconductor package using an aluminum nitride substrate | Keiichi Yano, Takashi Takahashi, Kazuo Kimura, Yoshitoshi Sato, Kouji Yamakawa +3 more | 1995-10-31 |