Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6323663 | Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method | Yoshirou Nakata, Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto +2 more | 2001-11-27 |
| 6005401 | Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method | Yoshirou Nakata, Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto +2 more | 1999-12-21 |
| 5945834 | Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method | Yoshirou Nakata, Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto +2 more | 1999-08-31 |
| 5037780 | Method for attaching semiconductors to a transparent substrate using a light-curable resin | Hiroaki Fujimoto, Yoshinobu Takeshita, Kazuya Otani, Koji Hidaka, Tsuguo Sakiyama | 1991-08-06 |