ET

Etsu Takeuchi

SC Sumitomo Bakelite Co.: 7 patents #30 of 790Top 4%
PR Promerus: 3 patents #51 of 140Top 40%
RI Riken: 2 patents #375 of 1,824Top 25%
Overall (All Time): #512,966 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9399725 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same Junya Kusunoki, Hiromichi Sugiyama, Toshiharu Kuboyama, Masakazu Kawata 2016-07-26
8053515 Directly photodefinable polymer compositions and methods thereof Edmund Elce, Andrew Bell, Brian Knapp, Hendra Ng, Larry F. Rhodes +8 more 2011-11-08
7858721 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom +7 more 2010-12-28
7524594 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom +7 more 2009-04-28
6709804 Printed wiring board and semiconductor device and processes to prepare the same Yusuke Tajima, Kazuo Takeuchi, Yasuo Shigemitsu 2004-03-23
6528231 PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE Yusuke Tajima, Kazuo Takeuchi, Yasuo Shigemitsu 2003-03-04
5507903 Process for producing two-layered tape for tab Yoshiyuki Yamamori, Shinichi Mikami, Toshio Nakao, Takuya Tochimoto 1996-04-16
5449584 Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound Toshio Banba, Toshiro Takeda, Naoshige Takeda, Akira Tokoh 1995-09-12
5385808 Photosensitive resin composition and semiconductor apparatus using it Akira Tokoh, Nobuyuki Sashida, Takashi Hirano 1995-01-31
5238784 Photosensitive resin composition with polyamic acid polymer Akira Tokoh, Nobuyuki Sashida, Takashi Hirano 1993-08-24