Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9399725 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same | Junya Kusunoki, Hiromichi Sugiyama, Toshiharu Kuboyama, Masakazu Kawata | 2016-07-26 |
| 8053515 | Directly photodefinable polymer compositions and methods thereof | Edmund Elce, Andrew Bell, Brian Knapp, Hendra Ng, Larry F. Rhodes +8 more | 2011-11-08 |
| 7858721 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom +7 more | 2010-12-28 |
| 7524594 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom +7 more | 2009-04-28 |
| 6709804 | Printed wiring board and semiconductor device and processes to prepare the same | Yusuke Tajima, Kazuo Takeuchi, Yasuo Shigemitsu | 2004-03-23 |
| 6528231 | PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE | Yusuke Tajima, Kazuo Takeuchi, Yasuo Shigemitsu | 2003-03-04 |
| 5507903 | Process for producing two-layered tape for tab | Yoshiyuki Yamamori, Shinichi Mikami, Toshio Nakao, Takuya Tochimoto | 1996-04-16 |
| 5449584 | Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound | Toshio Banba, Toshiro Takeda, Naoshige Takeda, Akira Tokoh | 1995-09-12 |
| 5385808 | Photosensitive resin composition and semiconductor apparatus using it | Akira Tokoh, Nobuyuki Sashida, Takashi Hirano | 1995-01-31 |
| 5238784 | Photosensitive resin composition with polyamic acid polymer | Akira Tokoh, Nobuyuki Sashida, Takashi Hirano | 1993-08-24 |