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Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same |
Etsu Takeuchi, Hiromichi Sugiyama, Toshiharu Kuboyama, Masakazu Kawata |
2016-07-26 |
| 8268540 |
Method of manufacturing light receiving device |
Toyosei Takahashi, Kazuto Oonami, Mitsuo Sugino, Masakazu Kawata, Rie Takayama +1 more |
2012-09-18 |
| 8030425 |
Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
Christopher Apanius, Matthew Apanius, Edmund Elce, Hendra Ng, Brian Knapp +2 more |
2011-10-04 |
| 7999354 |
Resin composition, filling material, insulating layer and semiconductor device |
Toyosei Takahashi, Rie Takayama, Hirohisa Dejima |
2011-08-16 |
| 7915467 |
Semiconductor wafer and semiconductor device |
Takashi Hirano |
2011-03-29 |
| 7808083 |
Semiconductor device |
Takashi Hirano |
2010-10-05 |