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Through via structure including a conductive portion and aligned solder portion |
Gian Pietro Vanalli, Giovanni Campardo, Paolo Pulici, Pier Paolo Stoppino |
2015-01-06 |
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Method for forming bumps in substrates with through vias |
Gian Pietro Vanalli, Giovanni Campardo, Paolo Pulici, Pier Paolo Stoppino |
2014-06-24 |
| 8228684 |
Multi chip electronic system |
Giovanni Campardo, Stefano Ricciardi |
2012-07-24 |
| 7616515 |
Integrated electronic device having a low voltage electric supply |
Giovanni Campardo, Gian Pietro Vanalli, Pier Paolo Stoppino, Roberto Dossi |
2009-11-10 |
| 6944072 |
Self-repair method for nonvolatile memory devices with erasing/programming failure, and relative nonvolatile memory device |
Rino Micheloni |
2005-09-13 |
| 6922366 |
Self-repair method for nonvolatile memory devices using a supersecure architecture, and nonvolatile memory device |
Rino Micheloni |
2005-07-26 |
| 6901011 |
Self-repair method via ECC for nonvolatile memory devices, and relative nonvolatile memory device |
Rino Micheloni |
2005-05-31 |
| 6225231 |
Recovery of damages in a field oxide caused by high energy ion implant process |
— |
2001-05-01 |
| 5598028 |
Highly-planar interlayer dielectric thin films in integrated circuits |
Maurizio Bacchetta |
1997-01-28 |
| 5543633 |
Process and structure for measuring the planarity degree of a dielectric layer in an integrated circuit and integrated circuit including means for performing said process |
Giuseppe Crisenza, Giorgio De Santi |
1996-08-06 |