Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8928123 | Through via structure including a conductive portion and aligned solder portion | Gian Pietro Vanalli, Giovanni Campardo, Aldo Losavio, Paolo Pulici | 2015-01-06 |
| 8759215 | Method for forming bumps in substrates with through vias | Gian Pietro Vanalli, Giovanni Campardo, Aldo Losavio, Paolo Pulici | 2014-06-24 |
| 7804322 | Output buffer | Michele Bartolini, Paolo Pulici, Gian Pietro Vanalli | 2010-09-28 |
| 7750690 | Output stage for electronic devices integrated on a semiconductor substrate, in particular for high frequency applications and corresponding method | Paolo Pulici, Michele Bartolini | 2010-07-06 |
| 7616515 | Integrated electronic device having a low voltage electric supply | Giovanni Campardo, Gian Pietro Vanalli, Roberto Dossi, Aldo Losavio | 2009-11-10 |
| 7463051 | Output buffer | Michele Bartolini, Paolo Pulici, Gian Pietro Vanalli | 2008-12-09 |