Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11601791 | Method for pairing devices using near field communication and electronic apparatus using same | Woowon Park, Jaehong Park | 2023-03-07 |
| 7863761 | Integrated circuit package system with molding vents | Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Sungpil Hur +3 more | 2011-01-04 |