SK

SeungJoo Kwak

SC Stats Chippac: 1 patents #282 of 425Top 70%
📍 Gyeongsan-si, KR: #124 of 242 inventorsTop 55%
Overall (All Time): #3,189,122 of 4,157,543Top 80%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8609525 Integrated circuit packaging system with interconnects and method of manufacture thereof BongHwan Han, Tae-Kyu Choi, DongWon Son, Gyung Sik Yun 2013-12-17