Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8609525 | Integrated circuit packaging system with interconnects and method of manufacture thereof | BongHwan Han, Tae-Kyu Choi, SeungJoo Kwak, Gyung Sik Yun | 2013-12-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8609525 | Integrated circuit packaging system with interconnects and method of manufacture thereof | BongHwan Han, Tae-Kyu Choi, SeungJoo Kwak, Gyung Sik Yun | 2013-12-17 |