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DongWon Son — 1 Patent

SCStats Chippac: 1 patents #359 of 425Top 85%
Seongju-eup, KR: #60 of 98 inventorsTop 65%
Overall (All Time): #2,406,284 of 4,157,543Top 60%
1 Patents All Time
DongWon Son has been granted 1 US patent while listed as an inventor at Stats Chippac. All of these patents were granted in 2013. DongWon Son ranks #2,406,284 of 4,157,543 US inventors in our database (top 57.9%). Patent records list DongWon Son in Seongju-eup, KR.

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8609525 Integrated circuit packaging system with interconnects and method of manufacture thereof BongHwan Han, Tae-Kyu Choi, SeungJoo Kwak, Gyung Sik Yun 2013-12-17

Frequent Collaborators

BongHwan Han1 shared
Gyung Sik Yun1 shared
SeungJoo Kwak1 shared
Tae-Kyu Choi1 shared

Nearby-Ranked Inventors

Andrew Whitesides Lloyd1
Xianwu Meng1
Phillip COLETTI1
Yuchen Mao1
Sheng'an ZHANG1
Hayeong Nam1
Pedro Fernando Gomez Fernandez1
Kira Astakhova1
Amir EISEN1