Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8609525 | Integrated circuit packaging system with interconnects and method of manufacture thereof | BongHwan Han, Tae-Kyu Choi, SeungJoo Kwak, DongWon Son | 2013-12-17 |
| 8304898 | Integrated circuit package system with overhang film | Hye Ran Lee, Sang-ha Hwang | 2012-11-06 |