JC

Joseph V. Cesna

SC Speedfam Co.: 13 patents #1 of 105Top 1%
SP Speedfam-Ipec: 7 patents #16 of 143Top 15%
📍 Niles, IL: #7 of 231 inventorsTop 4%
🗺 Illinois: #3,533 of 84,256 inventorsTop 5%
Overall (All Time): #211,943 of 4,157,543Top 6%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
6238271 Methods and apparatus for improved polishing of workpieces 2001-05-29
6168683 Apparatus and method for the face-up surface treatment of wafers 2001-01-02
6142857 Wafer polishing with improved backing arrangement 2000-11-07
6102779 Method and apparatus for improved semiconductor wafer polishing Inki Kim 2000-08-15
6089961 Wafer polishing carrier and ring extension therefor Inki Kim 2000-07-18
5993293 Method and apparatus for improved semiconductor wafer polishing Inki Kim 1999-11-30
5972162 Wafer polishing with improved end point detection 1999-10-26
5951370 Method and apparatus for monitoring and controlling the flatness of a polishing pad 1999-09-14
5938506 Methods and apparatus for conditioning grinding stones Clinton O. Fruitman, Philbin Scott 1999-08-17
5868605 In-situ polishing pad flatness control 1999-02-09
5803798 Dual column abrading machine Lawrence O. Day 1998-09-08
5791975 Backing pad Chris Karlsrud, Spencer Preston 1998-08-11
5791978 Bearing assembly for wafer planarization carrier Gordon J. Grosslight, Chris Karlsrud 1998-08-11
5782678 Dual column abrading machine Lawrence O. Day 1998-07-21
5595529 Dual column abrading machine Lawrence O. Day 1997-01-21
5486131 Device for conditioning polishing pads Anthony G. Van Woerkom 1996-01-23
5224304 Automated free abrasive machine for one side piece part machining 1993-07-06
4693012 Measuring bar for free abrasive machines 1987-09-15
4593716 Control valve assembly for abrasive slurry 1986-06-10
4519168 Liquid waxless fixturing of microsize wafers 1985-05-28
4270314 Bearing mount for lapping machine pressure plate 1981-06-02