YK

Yutaka Kaneda

SO Sony: 15 patents #2,858 of 25,231Top 15%
NT NTT: 8 patents #658 of 4,871Top 15%
KA Kaneka: 4 patents #309 of 1,525Top 25%
NP Nippon Telegraph And Telephone Public: 1 patents #297 of 842Top 40%
Overall (All Time): #170,554 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12049545 Uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite material Yoshio Furukawa 2024-07-30
8580903 Flame retardant, production method therefor, and flame retardant thermoplastic resin composition comprising the same Shuji Taketani, Hidekazu Kawakubo, Noriyuki Suzuki, Tetsuro Yamamoto 2013-11-12
7520053 Method for manufacturing a bump-attached wiring circuit board Keiichi Naito, Soichiro Kishimoto, Toshihiro Shinohara 2009-04-21
7407694 Block copolymer Akio Taniguchi, Kentaro Takesada, Tadashi Kokubo, Nobuaki Ohshiro, Atsushi Kumasaki +2 more 2008-08-05
7309736 Acrylic block copolymer and thermoplastic resin composition Akio Taniguchi, Tadashi Kokubo, Kentaro Takesada, Kozo Kondo, Takeshi Chiba +1 more 2007-12-18
7211735 Processes for manufacturing multilayer flexible wiring boards 2007-05-01
7076868 Wiring circuit board having bumps and method of producing same 2006-07-18
7020961 Method for manufacturing a bump-attached wiring circuit board Keiichi Naito, Soichiro Kishimoto, Toshihiro Shinohara 2006-04-04
6977349 Method for manufacturing wiring circuit boards with bumps and method for forming bumps Keiichi Naito, Toshihiro Shinohara 2005-12-20
6930390 Flexible printed wiring boards Akira Tsutsumi, Hiroyuki Hishinuma 2005-08-16
6800816 Wiring circuit board having bumps and method of producing same 2004-10-05
6562250 Method for manufacturing wiring circuit boards with bumps and method for forming bumps Keiichi Naito, Toshihiro Shinohara 2003-05-13
6553122 Method and apparatus for multi-channel acoustic echo cancellation and recording medium with the method recorded thereon Suehiro Shimauchi, Yoichi Haneda, Shoji Makino 2003-04-22
6518510 Bump-attached wiring circuit board and method for manufacturing same Keiichi Naito, Soichiro Kishimoto, Toshihiro Shinohara 2003-02-11
6312614 Method for production of interposer for mounting semiconductor element Yoshio Arimitsu 2001-11-06
6294316 Processes for manufacturing flexible printed wiring boards Akira Tsutsumi, Hiroyuki Hishinuma 2001-09-25
5774562 Method and apparatus for dereverberation Kenichi Furuya 1998-06-30
5602765 Adaptive transfer function estimating method and estimating device using the same Masashi Tanaka, Shoji Makino, Yoichi Haneda, Junji Kojima 1997-02-11
5539731 Echo cancelling method and apparatus using fast projection scheme Yoichi Haneda, Shoji Makino, Masashi Tanaka 1996-07-23
5408530 Echo cancelling method and echo canceller using the same Shoji Makino 1995-04-18
5208864 Method of detecting acoustic signal 1993-05-04
5187692 Acoustic transfer function simulating method and simulator using the same Yoichi Haneda, Shoji Makino 1993-02-16
4683590 Inverse control system Masato Miyoshi, Juro Ohga 1987-07-28
4536887 Microphone-array apparatus and method for extracting desired signal Juro Ohga 1985-08-20