Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7638876 | Bumpless semiconductor device | Yukio Yamada, Masayuki Nakamura | 2009-12-29 |
| 7109058 | Bumpless semiconductor device | Yukio Yamada, Masayuki Nakamura | 2006-09-19 |
| 7053312 | Flexible wiring boards | Hideyuki Kurita, Ryo Ito, Masayuki Nakamura | 2006-05-30 |
| 6930390 | Flexible printed wiring boards | Yutaka Kaneda, Akira Tsutsumi | 2005-08-16 |
| 6848176 | Process for manufacturing flexible wiring boards | Hideyuki Kurita, Ryo Ito, Masayuki Nakamura | 2005-02-01 |
| 6812060 | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards | Hideyuki Kurita | 2004-11-02 |
| 6717064 | Substrate piece and flexible substrate | Hideyuki Kurita, Masato Taniguchi, Masayuki Nakamura, Hidetsugu Namiki | 2004-04-06 |
| 6653736 | Multilayer flexible wiring boards | Soichiro Kishimoto | 2003-11-25 |
| 6643923 | Processes for manufacturing flexible wiring boards | Hideyuki Kurita, Ryo Ito, Masayuki Nakamura | 2003-11-11 |
| 6524892 | Method of fabricating multilayer flexible wiring boards | Soichiro Kishimoto | 2003-02-25 |
| 6294316 | Processes for manufacturing flexible printed wiring boards | Yutaka Kaneda, Akira Tsutsumi | 2001-09-25 |