Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7520053 | Method for manufacturing a bump-attached wiring circuit board | Yutaka Kaneda, Keiichi Naito, Soichiro Kishimoto | 2009-04-21 |
| 7098132 | Method of manufacturing flexible wiring board | Keiichi Naitoh, Masahiro Watanabe | 2006-08-29 |
| 7020961 | Method for manufacturing a bump-attached wiring circuit board | Yutaka Kaneda, Keiichi Naito, Soichiro Kishimoto | 2006-04-04 |
| 6977349 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | Yutaka Kaneda, Keiichi Naito | 2005-12-20 |
| 6912779 | Method of manufacturing flexible wiring board | Keiichi Naitoh, Masahiro Watanabe | 2005-07-05 |
| 6840430 | Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards | Hideyuki Kurita, Masanao Watanabe, Mitsuhiro Fukuda, Yukio Anzai | 2005-01-11 |
| 6596947 | Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards | Hideyuki Kurita, Masanao Watanabe, Mitsuhiro Fukuda, Yukio Anzai | 2003-07-22 |
| 6562250 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | Yutaka Kaneda, Keiichi Naito | 2003-05-13 |
| 6518510 | Bump-attached wiring circuit board and method for manufacturing same | Yutaka Kaneda, Keiichi Naito, Soichiro Kishimoto | 2003-02-11 |
| 6437251 | Flexible board made by joining two pieces through an adhesive film | Hideyuki Kurita, Masanao Watanabe, Yukio Anzai, Mitsuhiro Fukuda | 2002-08-20 |
| 4390895 | Color image pick-up apparatus | Itsuzo Sato, Kazushige Ooi, Kikuo Saito, Yasuo Takemura | 1983-06-28 |