Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107855 | Method for bonding and connecting substrates | Yoshiya Hagimoto, Kenichi Aoyagi, Yoshihisa Kagawa | 2021-08-31 |
| 11031431 | Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus | Yoshiya Hagimoto | 2021-06-08 |
| 11024658 | Image sensor including grooves | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2021-06-01 |
| 10991745 | Semiconductor device, method of manufacturing the same, and electronic apparatus | Suguru SAITO, Ryosuke Matsumoto, Yoshifumi Zaizen, Shuji Manda, Shunsuke Maruyama +1 more | 2021-04-27 |
| 10985102 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus | Yoshihisa Kagawa, Kenichi Aoyagi, Yoshiya Hagimoto | 2021-04-20 |
| 10818717 | Stacked lens structure, method of manufacturing the same, and electronic apparatus | Hiroyasu Matsugai, Hiroyuki Itou, Suguru SAITO, Keiji Ohshima, Masanori Iwasaki +5 more | 2020-10-27 |
| 10804313 | Semiconductor device and solid-state imaging device | Yoshihisa Kagawa, Masanaga Fukasawa, Tokihisa KANEGUCHI, Yoshiya Hagimoto, Kenichi Aoyagi +1 more | 2020-10-13 |
| 10753551 | Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate | Toshiaki Hasegawa, Kenichi Aoyagi, Yoshiya Hagimoto | 2020-08-25 |
| 10712543 | Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrate | Kunihiko Hikichi, Koichi Takeuchi, Toshihiro Kurobe, Hiroyasu Matsugai, Hiroyuki Itou +5 more | 2020-07-14 |
| 10707258 | Semiconductor device with multiple substrates electrically connected through an insulating film | Yoshiya Hagimoto, Kenichi Aoyagi, Yoshihisa Kagawa | 2020-07-07 |
| 10690814 | Lens substrate, semiconductor device, and electronic apparatus | Toshiaki Shiraiwa, Masaki Okamoto, Hiroyasu Matsugai, Hiroyuki Itou, Suguru SAITO +3 more | 2020-06-23 |
| 10627549 | Stacked lens structure, method of manufacturing the same, and electronic apparatus | Atsushi Yamamoto, Koichi Takeuchi, Toshihiro Kurobe, Hiroyasu Matsugai, Hiroyuki Itou +5 more | 2020-04-21 |
| 10608028 | Image sensor having improved dicing properties | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2020-03-31 |
| 10534162 | Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic device | Hirotaka YOSHIOKA, Hiroyasu Matsugai, Hiroyuki Itou, Suguru SAITO, Keiji Ohshima +3 more | 2020-01-14 |
| 10485293 | Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereof | Yoshiya Hagimoto, Kenichi Aoyagi | 2019-11-26 |
| 10431621 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus | Yoshihisa Kagawa, Kenichi Aoyagi, Yoshiya Hagimoto | 2019-10-01 |
| 10431618 | Stacked lens structure method of manufacturing the same, and electronic apparatus | Hiroyasu Matsugai, Hiroyuki Itou, Suguru SAITO, Keiji Ohshima, Masanori Iwasaki +5 more | 2019-10-01 |
| 10379323 | Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method | Yusuke Moriya, Masanori Iwasaki, Takashi OINOUE, Yoshiya Hagimoto, Hiroyasu Matsugai +6 more | 2019-08-13 |
| 10236238 | Semiconductor device | Yoshihisa Kagawa | 2019-03-19 |
| 10217791 | Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera | — | 2019-02-26 |
| 10134795 | Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method | Yoshiya Hagimoto, Kenichi Aoyagi, Yoshihisa Kagawa | 2018-11-20 |
| 10038021 | Packaged image sensor having improved dicing properties | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2018-07-31 |
| 10038024 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus | Yoshihisa Kagawa, Kenichi Aoyagi, Yoshiya Hagimoto | 2018-07-31 |
| 10026769 | Semiconductor device and solid-state imaging device | Yoshihisa Kagawa, Masanaga Fukasawa, Tokihisa KANEGUCHI, Yoshiya Hagimoto, Kenichi Aoyagi +1 more | 2018-07-17 |
| 9991301 | Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya +4 more | 2018-06-05 |